High-Density Interconnect HDI PCB manufacturer
High-quality HDI PCBs meet the demanding requirements of modern electronic devices. Our state-of-the-art manufacturing facility is equipped with the latest technology and staffed by experienced professionals who are committed to delivering the best possible results.
In addition to our standard HDI PCB manufacturing services, we also offer a range of customization options to meet your specific needs. From specialized finishes to advanced testing and inspection services, we can provide a comprehensive solution that meets your unique requirements.
If you are looking for a reliable and experienced HDI PCB manufacturer, look no further than our company. Contact us today to learn more about our services and how we can help you achieve your goals.
HDI PCB Stack-up suggestions, design for manufacturing
When designing a HDI PCB, the stack-up is an essential consideration that can greatly impact the performance of the board.
Here are some general suggestions for HDI PCB stack-up:
Consider the number of layers: HDI PCBs typically have more layers than traditional PCBs. Generally, a 4-layer or 6-layer board is considered standard, while an 8-layer or 10-layer board is considered high density.
Determine the layer order: The order of the layers in the stack-up can have a significant impact on the performance of the board. Generally, it is best to place the power and ground planes in the inner layers of the stack-up. This helps to reduce electromagnetic interference (EMI) and provides better signal integrity.
Consider the thickness of the copper layers: The thickness of the copper layers should be chosen based on the required current carrying capacity and thermal management of the board. Thicker copper layers can handle more current but can also create more heat.
Use high-performance materials: HDI PCBs require high-performance materials to achieve their high-density features. Consider using materials such as high-Tg FR-4, Rogers, or other advanced laminates to ensure the PCB’s performance.
Consider the placement of vias: Vias are a critical component of HDI PCBs, as they allow for the routing of signals between layers. The placement of vias should be carefully considered to ensure the best signal integrity and minimize EMI.
Use blind and buried vias: Blind and buried vias can help reduce the size of the PCB while maintaining signal integrity. These vias are drilled between specific layers and do not pass through the entire board.
Follow industry standards: It is always best to follow industry standards when designing an HDI PCB. The IPC-2221 standard provides guidelines for the design of high-density interconnects, including stack-up recommendations.
By following these suggestions, you can ensure that your HDI PCB has the best possible performance and meets the required specifications.
But don’t worry, if you are not sure or worry the rationality and manufacturability of the design, you can send the design draft to us at any time, professional engineering and technical personnel will do production audit for you.
MorePCB capabilities features of HDI PCB manufacturing
High-precision drilling: 0.10- 0.15 mm drilling diameter. Our high-precision drilling equipment that can accurately place and drill these small holes.
Laser drilling: For microvias and other small vias, laser drilling is often used instead of mechanical drilling. It’s enable the creation of a high-density interconnect structure that can accommodate the large number of solder balls required for BGA packages.
High-precision imaging: HDI PCBs have very small components and interconnects, which require high-precision imaging equipment to accurately inspect and test the board during manufacturing.
Advanced lamination techniques: HDI PCBs often require multiple layers and complex lamination techniques to achieve the desired density and reliability.Our specialized lamination equipment that can precisely align and bond multiple layers together.
Advanced plating techniques: HDI PCBs require advanced plating techniques to ensure that the via walls are coated uniformly and reliably.
Advanced surface finishing: HDI PCBs often require advanced surface finishing techniques, such as electroless nickel immersion gold (ENIG) or immersion silver, to ensure reliable soldering and long-term performance.
Quality control and testing: HDI PCBs require rigorous quality control and testing throughout the manufacturing process to ensure that the board meets the required specifications for density, reliability, and performance.