PCB Design for NVIDIA Jetson and Raspberry Pi AI Modules – What Engineers Must Know

Edge AI computing has moved from research labs into production hardware at remarkable speed. NVIDIA Jetson modules and Raspberry Pi Compute Modules are now at the center of countless real-world AI applications — from autonomous robotics and smart cameras to industrial inspection systems, medical imaging devices, and AI-powered IoT gateways.

Both platforms share a common design pattern: they are System-on-Module (SOM) solutions that rely entirely on a custom carrier board designed by the engineer to connect the module to the outside world. The module itself handles the compute. Your PCB handles everything else — power delivery, connectivity, thermal management, signal routing, and physical integration.

Getting that carrier board design right is not optional. A poorly designed carrier board for a Jetson Orin or Raspberry Pi CM4 will produce a system that is unreliable, thermally unstable, electromagnetically noisy, or simply non-functional — regardless of how powerful the module itself is. This guide covers the critical design considerations for both platforms and explains why choosing the right manufacturing partner is the final variable between a great design and a great product.

Understanding the Design Challenge: SOM Carrier Board Fundamentals

When designing a carrier board for any AI module — whether NVIDIA Jetson, Raspberry Pi Compute Module 4, or equivalent — the engineer is responsible for:

• Power supply design — Generating all required voltages from the input supply with sufficient current headroom and low noise
• High-speed signal routing — USB 3.x, PCIe, MIPI CSI/DSI, SDIO, Ethernet, and other interfaces that require controlled impedance and careful layout
• Thermal management — Providing adequate heatsink mounting area, thermal vias, and airflow considerations around the module
• Connector and form factor integration — Designing for the specific mechanical footprint and mating connector of the target module
• EMI and signal integrity — Ensuring high-speed signals are routed cleanly, with proper reference planes and shielding to pass regulatory compliance testing

Each of these areas has specific PCB design requirements that differ meaningfully between the Jetson and Raspberry Pi platforms.

PCB Design Considerations for NVIDIA Jetson Modules

NVIDIA Jetson modules — including the Jetson Orin Nano, Jetson Orin NX, and Jetson AGX Orin — connect to carrier boards through a high-density board-to-board connector carrying power, PCIe, USB, MIPI, UART, I2C, SPI, and other interfaces simultaneously.

Power Delivery for Jetson Carrier Boards

Jetson modules have demanding and precise power requirements. The main module power input (VDD_IN) must be within the module’s specified voltage range, with a low-impedance delivery path capable of handling the full rated current including peak transient loads during AI inference bursts.

Key power design rules for Jetson carrier boards:

• Use dedicated switching regulators with tight output voltage tolerance for each required rail
• Place bulk electrolytic capacitors (100µF–470µF) close to the module connector power pins
• Place ceramic decoupling capacitors (100nF–10µF, X7R) within 3mm of each connector power pin
• Ensure ground planes are continuous and uninterrupted under all power and high-speed signal areas
• Include a power sequencing circuit or PMIC that follows the Jetson module’s required power-on and power-off sequence exactly

Incorrect power sequencing is one of the leading causes of Jetson module damage during bring-up. It is not recoverable.

High-Speed Signal Routing on Jetson Carrier Boards

The Jetson connector carries several high-speed differential interfaces that require controlled impedance routing:

• PCIe Gen3 x4 / x2 / x1 — 85Ω differential, length-matched lanes, reference plane continuity across all vias
• USB 3.2 Gen 1 / Gen 2 — 90Ω differential, routed as tightly coupled differential pairs
• MIPI CSI-2 / DSI — 100Ω differential, extremely sensitive to length mismatch and layer changes
• SDIO — 50Ω single-ended, with source-series termination resistors placed within 15mm of the connector

All high-speed traces must be routed on inner stripline layers whenever possible, flanked by continuous ground reference planes. Every layer transition must include ground stitching vias adjacent to the signal vias to maintain return path continuity.

Thermal Considerations

Jetson Orin modules can dissipate between 7W and 60W depending on the variant and workload. The carrier board must provide a flat, thermally conductive surface for the module’s heatsink mounting interface. Avoid placing tall components within the heatsink exclusion zone defined in the module’s design guide. Thermal vias under the module seating area help conduct heat away from the board layer into an aluminum heat spreader or chassis mount.

PCB Design Considerations for Raspberry Pi Compute Module 4

The Raspberry Pi CM4 connects to its carrier board through two 100-pin high-density board-to-board connectors (Hirose DF40 series) carrying USB, PCIe Gen 2, MIPI CSI/DSI, SDIO, HDMI, GPIO, and power.

Power Delivery for CM4 Carrier Boards

The CM4 requires a clean 5V supply capable of delivering at least 3A for the module alone, with additional current budget for peripherals on the carrier board. Key points:

• Use a dedicated 5V regulator or high-quality DC-DC converter — do not power the CM4 from a noisy or marginal supply
• Place bulk capacitance close to the CM4 connector power pins
• Include a suitable fuse or resettable polyfuse for overcurrent protection
• Design the ground plane to be continuous and unbroken under the entire CM4 footprint

High-Speed Interfaces on CM4 Carrier Boards

• PCIe Gen 2 x1 — 100Ω differential pair, routed on inner stripline layers, length-matched, with no 90° trace corners
• USB 2.0 — 90Ω differential, kept as short as possible with series resistors at the source
• MIPI CSI-2 (2-lane and 4-lane) — 100Ω differential, the most layout-sensitive interface on the CM4 carrier board
• HDMI — 100Ω differential, requires careful ESD protection component placement without disturbing impedance
• SDIO — 50Ω single-ended, requires careful length matching across all data lines

The CM4’s PCIe interface, while only Gen 2, still requires full controlled impedance routing discipline. Engineers who treat it as a low-speed interface consistently encounter link stability and throughput issues in production.

Board Layer Count for CM4 Designs

A minimum of 4 layers is required for a reliable CM4 carrier board. For designs with PCIe, multiple MIPI CSI cameras, and USB 3.0 added through an external hub IC, 6 to 8 layers is strongly recommended to maintain clean reference planes for all high-speed signals without routing compromises.

Common PCB Design Mistakes on Jetson and Raspberry Pi Carrier Boards

Both platforms share a set of design mistakes that consistently cause failures during bring-up and field operation:

Every one of these mistakes is preventable at the design stage — and catchable by a manufacturer with a thorough DFM review process before production begins.

Why Choosing the Right Manufacturer Matters for AI Module Carrier Boards

Jetson and CM4 carrier boards are not simple boards. They combine fine-pitch high-density connectors, multiple controlled impedance interfaces, demanding power delivery requirements, and strict thermal design rules — all in a compact form factor. A manufacturer without the right capabilities will produce boards that look correct but perform poorly or fail entirely.

Here is what to verify before selecting a manufacturer for your AI module carrier board:

MorePCB: The Manufacturing Partner for AI Module Carrier Board Projects

For engineers building carrier boards for NVIDIA Jetson, Raspberry Pi CM4, or other AI edge computing modules, MorePCB brings together every capability these demanding designs require.

With over 15 years of advanced PCB manufacturing experience, MorePCB is equipped to support your AI module carrier board project from first prototype through full production:​

PCB Design Support — MorePCB’s experienced engineering team provides DFM review, component placement guidance, stack-up consultation, and signal integrity analysis. For carrier board designs where power sequencing, controlled impedance, and fine-pitch connector footprints must all be correct before production begins, this engineering partnership is genuinely valuable.

PCB Fabrication — MorePCB manufactures single-sided, double-sided, and multilayer PCBs at the 4 to 8+ layer counts that Jetson and CM4 carrier board designs require. Material options include FR-4 for standard carrier board applications, PTFE/Rogers for carrier boards incorporating RF or high-frequency modules, Aluminum for designs requiring enhanced thermal dissipation, and Ceramic for specialized high-reliability environments. Surface finish options — HASL, ENIG, and OSP — cover all connector soldering and fine-pitch BGA assembly requirements that AI module carrier boards demand.

Advanced PCB Capabilities — MorePCB supports HDI (High Density Interconnect) designs, multilayer boards, and rigid-flex PCBs — all of which are relevant for AI edge hardware where dense connector fan-out, compact form factors, and tight routing spaces are routine design constraints.

Turnkey PCB Assembly — MorePCB offers full turnkey assembly services covering SMT, through-hole, and mixed-technology processes with rigorous quality control and AOI (Automated Optical Inspection) at every stage. Fine-pitch connector placement, 0402 and 0201 passive components, and BGA devices are all handled with the precision that Jetson and CM4 carrier board designs require for reliable bring-up.

PCB Prototyping — MorePCB’s fast-turnaround prototyping services allow engineers to iterate quickly on carrier board designs. Carrier boards for AI modules almost always require at least one prototype revision — catching power sequencing issues, connector footprint corrections, or impedance routing problems before the design is locked for production. Fast prototype turnaround directly shortens the development cycle and reduces total project cost.

PCB Testing — Comprehensive electrical testing, functional testing, and environmental testing ensure that every board meets its full specification before leaving the facility. For carrier boards that will operate in field environments — industrial enclosures, outdoor robotics, automotive applications — environmental testing provides the confidence that the hardware will perform reliably over its intended service life.

MorePCB holds UL, ISO, and SGS certifications, meeting the internationally recognized quality standards that product certification bodies, enterprise customers, and regulated market applications require.

And critically for engineering teams working globally: MorePCB ships worldwide. Whether your team is located in the United States, the United Kingdom, Germany, Japan, South Korea, Taiwan, Australia, India, Singapore, the UAE, Brazil, or anywhere else across the planet — MorePCB delivers your carrier boards reliably to your location. Global shipping is a standard part of MorePCB’s service offering, and wherever in the world your AI module project is based, distance is never a reason to compromise on PCB manufacturing quality.

Explore MorePCB’s full manufacturing capabilities at morepcb.com/capabilities, or contact our engineering team to discuss your Jetson or Raspberry Pi carrier board project today.

Final Thoughts

Designing a carrier board for NVIDIA Jetson or Raspberry Pi AI modules is one of the most rewarding and technically demanding tasks in embedded hardware engineering. When the design is done well — with proper power sequencing, controlled impedance routing, thermal discipline, and a layer stackup that supports all the required high-speed interfaces — the result is a platform that unlocks the full computational potential of the module it hosts.

When it is done poorly, even the most powerful Jetson Orin or CM4 module will fail to perform. Power sequencing errors damage hardware permanently. Signal integrity failures make high-speed interfaces unusable. Thermal design failures cause throttling and shortened component life.

The path to getting it right combines rigorous application of the design rules covered in this article with a manufacturing partner who understands the demands of AI module carrier board production. MorePCB provides both the fabrication capability and the engineering support to take your design from concept to a reliable, production-ready carrier board — and deliver it to you anywhere in the world.

FAQ

Q: What is a carrier board and why does its PCB design matter for NVIDIA Jetson and Raspberry Pi modules?

A: A carrier board is the custom PCB that hosts a System-on-Module (SOM) like the NVIDIA Jetson or Raspberry Pi Compute Module 4, providing all the external connectivity, power delivery, and peripheral interfaces that the module itself does not include. The module handles the AI computing. The carrier board handles everything else — power rails, USB ports, cameras, storage, networking, and GPIO. Because the module connects to the carrier board through high-density, high-speed board-to-board connectors, the PCB design quality directly determines whether high-speed interfaces like PCIe, MIPI CSI, and USB operate reliably. A poorly designed carrier board will cause system instability, signal failures, and thermal problems regardless of how capable the AI module is.

Q: What are the most critical PCB design rules for NVIDIA Jetson carrier boards?

A: The most critical design rules for Jetson carrier boards are power sequencing compliance, controlled impedance routing, and thermal management. Power sequencing must follow the exact power-on and power-off order specified in NVIDIA’s Jetson module design guide — violating this sequence can permanently damage the module. All high-speed interfaces including PCIe, USB 3.x, and MIPI CSI must be routed as controlled impedance differential pairs on inner stripline layers with continuous ground reference planes. Bulk and decoupling capacitors must be placed as close as possible to the module connector power pins. Finally, the heatsink exclusion zone around the module footprint must be kept clear of tall components to allow proper thermal contact.

Q: How many PCB layers does a Raspberry Pi CM4 carrier board need?

A: A minimum of 4 layers is required for a reliable Raspberry Pi CM4 carrier board. A 4-layer stackup with top signal, ground plane, power plane, and bottom signal arrangement provides the reference planes necessary for clean USB 2.0, SDIO, and basic PCIe routing. However, for carrier boards that include multiple MIPI CSI camera interfaces, USB 3.0 hubs, HDMI output, and additional peripherals, 6 to 8 layers is strongly recommended. The additional layers allow dedicated reference planes for each high-speed signal group without routing compromises, reducing crosstalk, improving impedance control, and making EMI compliance significantly easier to achieve.

Q: What impedance values are required for PCIe and MIPI CSI interfaces on Jetson and CM4 carrier boards?

A: PCIe differential pairs on both Jetson and CM4 carrier boards require 85Ω differential impedance (Jetson) or 100Ω differential impedance (CM4, following standard PCIe specifications), with lane-to-lane length matching within a few mils to prevent timing skew. MIPI CSI-2 differential pairs require 100Ω differential impedance on both platforms, with intra-pair length matching that is extremely tight — typically within 5 mils. USB 3.x SuperSpeed differential pairs require 90Ω differential impedance. These values must be achieved through controlled impedance manufacturing, where the fabricator adjusts trace geometry to hit the specified target and verifies results with TDR test coupons. A manufacturer without controlled impedance capability cannot reliably produce carrier boards for these modules.

Q: What surface finish is recommended for Jetson and CM4 carrier board connectors?

A: ENIG (Electroless Nickel Immersion Gold) is the recommended surface finish for carrier boards hosting NVIDIA Jetson or Raspberry Pi CM4 modules. The high-density board-to-board connectors used by both platforms — particularly the Hirose DF40 series on the CM4 and the Samtec or equivalent connectors on Jetson modules — require a flat, oxidation-resistant pad surface for reliable mating and long-term contact integrity. ENIG provides exactly this, with a flat gold surface that ensures consistent connector insertion force and stable electrical contact over many mating cycles. ENIG is also compatible with the fine-pitch SMT passives and any BGA components commonly placed on AI module carrier boards.

Q: What thermal design practices should I follow for a Jetson Orin carrier board?

A: Thermal management on a Jetson Orin carrier board begins with providing a flat, unobstructed mechanical surface within the module’s heatsink mounting footprint. No tall components should be placed within the heatsink exclusion zone defined in the Jetson module’s design guide. Thermal vias should be placed in a dense array under the module seating area to conduct heat vertically through the PCB into an aluminum chassis mount or heat spreader. Copper pours on inner and outer layers in the module mounting region help spread heat laterally before it reaches the thermal interface. For high-power Jetson AGX Orin designs dissipating 60W or more, the carrier board’s copper thickness and thermal via density should be calculated to ensure the junction-to-ambient thermal resistance stays within the module’s specified operating range under worst-case AI workload conditions.

Q: What are the most common bring-up failures on Jetson and CM4 carrier boards and how can they be avoided?

A: The most common bring-up failures include power sequencing violations that damage the Jetson module before software even loads, voltage rail noise that causes random system crashes under AI inference load, MIPI CSI camera interfaces that produce corrupted images or no signal due to impedance mismatch or lane length skew, PCIe link instability caused by uncontrolled trace impedance or missing AC coupling capacitors, and connector soldering failures from footprints that do not match the manufacturer’s recommended land pattern. These failures can be avoided through careful adherence to the module’s reference design guidelines, thorough DRC and DFM review before prototype fabrication, and prototyping with a manufacturer who performs incoming DFM review and delivers boards with verified impedance test coupon results.

Q: How does choosing the right PCB manufacturer reduce carrier board design risk?

A: The right manufacturer reduces carrier board design risk in three ways. First, their DFM engineering review catches design issues before production — incorrect footprints, clearance violations, power plane splits under high-speed signals, and trace width inadequacies that would cause failures during bring-up. Second, their controlled impedance manufacturing capability ensures that PCIe, USB, and MIPI interfaces meet their electrical specifications in the physical board, not just in simulation. Third, their comprehensive electrical testing confirms that no short circuits, open circuits, or impedance anomalies escaped the fabrication process. Manufacturers without these capabilities produce boards that look correct visually but fail electrically — and tracing the root cause of subtle signal integrity or power delivery failures back to a manufacturing defect can cost weeks of engineering time.

Q: Can MorePCB manufacture carrier boards for NVIDIA Jetson and Raspberry Pi CM4 modules?

A: Yes. MorePCB manufactures multilayer PCBs including the 4 to 8+ layer counts used in Jetson and CM4 carrier board designs, with controlled impedance fabrication, ENIG surface finish, HDI capability for dense connector fan-out, and full turnkey SMT assembly with AOI inspection. Their engineering team provides DFM review for incoming designs, helping catch placement, routing, and manufacturability issues before production begins. MorePCB also offers fast-turnaround prototyping services that allow engineers to iterate quickly on carrier board designs before committing to full production volumes. All of this is supported by UL, ISO, and SGS certifications that verify consistent quality across every order.

Q: Does MorePCB ship carrier boards to customers internationally?

A: Yes. MorePCB ships to customers worldwide as a standard part of their manufacturing service. Engineering teams and hardware companies across North America, Europe, the United Kingdom, Germany, France, the Netherlands, Japan, South Korea, Taiwan, Australia, India, Singapore, the UAE, Brazil, and every other major region receive their boards through MorePCB’s global delivery network. Whether you are ordering a small batch of prototype carrier boards to validate a new Jetson or CM4 design, or scaling to full production volume, MorePCB handles international delivery reliably to your location — no matter where in the world your project is based. Geography is never a barrier when you work with a manufacturer built for global service.