FR4 PCB Capability

With 15+ years’ experience in PCB fabrication, we have handled hundreds of thousands of PCB projects, and covered almost all kinds of substrate materials including FR4Aluminum(PTFE)Rogers, etc. This page only touches standard FR4 based PCB. For PCBs with special technical substrate, please refer to corresponding web pages for information.

We can manufacture up to 10 million pieces high quality PCBs with very competitive prices. To endow your project with expected function and more possibilities, we offer advanced features for FR4 PCB services. Comprehensive capabilities can be found in the following table:

Quality GradeStandard IPC 2/3
Number of Layers1 – 32layers
Shortest Build Time0.5days
MaterialFR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg
Board SizeMin 6*6mm | Max 600*700mm
Board size tolerance±0.1mm
Board Thickness0.4mm – 4.5mm
Board Thickness Tolerance±0.1mm /– ±10%
Copper Weight0.5oz – 6.0oz
Inner Layer Copper Weight0.5oz – 2.0oz
Copper Thickness Tolerance±5μm
Min Tracing/Spacing3mil/3mil
Solder Mask ColorGreen, White, Blue, Black, Red, Yellow,Purple
Silkscreen ColorWhite, Blue, Black, Red, Yellow
Surface FinishHASL – Hot Air Solder Leveling Lead Free HASL – RoHS
ENIG – Electroless Nickle/Immersion Gold – RoHS
ENEPIG – Electroless Nickel Electroless Palladium Immersion Gold -RoHS
Immersion Silver – RoHS, Immersion Tin – RoHS
OSP -Organic Solderability Preservatives – RoHS
Min Annular Ring3mil
Min Drilling Hole DiameterStandard 8mil, Advanced 6mil, Laser drill 4mil
Min Width of Cutout (NPTH)0.8mm
NPTH Hole Size Tolerance±.002″ (±0.05mm)
Min Width of Slot Hole (PTH)0.6mm
PTH Hole Size Tolerance±.003″ (±0.08mm) – ±.006″ (±0.15mm)
Surface/Hole Plating Thickness20μm – 30μm
SM Tolerance (LPI).003″ (0.075mm)
Aspect Ratio1.10 (hole size: board thickness)
TestAOI, 10V – 250V flying probe or testing fixture
Impedance tolerance±5% – ±10%
SMD Pitch0.2mm(8mil)
BGA Pitch0.2mm(8mil)
Chamfer of Gold Fingers20, 30, 45, 60
Other TechniquesGold fingers,Blind and Buried holes,Peelable solder mask
Edge plating,Carbon mask,Countersink/counterbore hole
Half-cut/Castellated hole,Press fit hole,Via in pad
Via tented/covered with resin
Via plugged/filled with resin

 Any FR4 PCB manufacturing ,design question, send email to us.

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